AMD partnered up with Celsia to work on a vapor chamber based cooling solution for high-end graphics cards. This product will include Celsia's patented NanoSpreader, a type of phase-change cooling that should perform up to 30 percent better in terms of thermal resistance than traditional heatpipe cooling designs, resulting in a much lower GPU temperature.
Celsia claims their NanoSpreaders are half the weight of solid copper, yet can transfer heat at roughly ten times the rate (thermal conductivity).
“Working with AMD, we were able to meet all of the design criteria for a new GPU cooler.
Namely, it had to be lighter, perform better and be lower cost than the current heat pipe based
design,” said Joe Formichelli, Celsia’s CEO. “Unlike thermal modules using heat pipes, our twophase
NanoSpreader comes in direct contact with the heat source whereby removing costly, heavy
As part of AMD’s technology development project, Celsia has been invited to present at the 2008
AMD Technical Forum and Exposition tomorrow in Taiwan. Additionally, a short video
explaining Celsia’s NansoSpreader vapor chamber technology will be shown as part of the
conference’s opening presentation.