Celsia claims their NanoSpreaders are half the weight of solid copper, yet can transfer heat at roughly ten times the rate (thermal conductivity).
“Working with AMD, we were able to meet all of the design criteria for a new GPU cooler. Namely, it had to be lighter, perform better and be lower cost than the current heat pipe based design,” said Joe Formichelli, Celsia’s CEO. “Unlike thermal modules using heat pipes, our twophase NanoSpreader comes in direct contact with the heat source whereby removing costly, heavy base plates.”
As part of AMD’s technology development project, Celsia has been invited to present at the 2008 AMD Technical Forum and Exposition tomorrow in Taiwan. Additionally, a short video explaining Celsia’s NansoSpreader vapor chamber technology will be shown as part of the conference’s opening presentation.