Posted on Monday, July 06 2009 @ 15:48 CEST by Thomas De Maesschalck
New details leaked about the Atom deal between Intel and TSMC. According to an Asian report, Intel will use some IP from TSMC to fill out its upcoming ultramobile Langwell southbridge (I/O hub). This will enable customers to order customized versions of Langwell:
Chronologically speaking, the first question that the new rumor sheds light on is about the mysterious I/O blocks, which have not been identified even as more recent Moorestown features have been revealed. With the news that Intel will fab Langwell on TSMC's process and customize the chip using non-Intel IP blocks, we now know that these "I/O blocks" are left unspecified by design. As in, a hypothetical fab customer who wants a customized version of Langwell will specify the number and nature of the (TSMC-authored) IP blocks that go into the empty slots.
The other interesting thing about this rumor is that it gives insight into how Intel will use its relationship with TSMC. Intel has maintained from the start that their intention is to offer potential "embedded x86" customers more options for using its processor designs for different applications, with customization being essential to these plans. My reading of this was that they would be let customers use third-party IP on the SoC part of the chipset, but clearly the real target for customization is the I/O hub.
More info
at ARS Technica.
