Posted on Wednesday, June 05 2013 @ 9:35 CEST by Thomas De Maesschalck
TPU
spotted the ASUS Maximus VI Formula motherboard at Computex. Based on the Intel Z87 chipset, this motherboard is designed for liquid cooled systems with up to three graphics cards. It features a thermal armor that covers most of the motherboard, and the armor makes contact with a waterblock that cools the CPU VRM area.
The Maximus VI Formula uses an identical CPU VRM to the Maximus VI Extreme. The board draws power from a combination of 24-pin ATX and 8-pin EPS. A 4-pin ATX and Molex can be optionally connected to stabilize overclocks. The LGA1150 socket is wired to four DDR3 DIMM slots, and three PCI-Express 3.0 x16 slots (x16/NC/NC or x8/x8/NC or x8/x4/x4), it lacks the PEX8747 bridge chip of its bigger sibling. Three other PCI-Express 2.0 x1 chips make for the rest of the expansion. Connectivity on the Maximus VI Formula includes ten SATA 6 Gb/s ports, eight USB 3.0 ports, SupremeFX audio, gigabit Ethernet (Intel controller), 802.11 ac WiFi, and Bluetooth 4.0. ASUS didn't reveal launch plans.
