Foundries increasing 200mm production capacity for Internet of Things chips

DigiTimes writes semiconductor chip foundries are planning to increase their 200mm wafer capacity. Chinese firm SMIC is looking to expand its 200mm wafer fab in Shenzhen, while TSMC and UMC plan to build additional capacity at their 200mm fabs in China. The main reason for the capacity increases is the Internet of Things, which is regarded as the next growth opportunity in the semiconductor market.

SMIC has disclosed plans to expand capacity at its Shenzhen fab to 20,000 8-inch wafers monthly by the end of 2015 from 10,000 units in end-2014. Including production capacities at its other 8-inch fabs, SMIC's overall 8-inch fab capacity is set to exceed 150,000 units a month.

Since 2014, TSMC has been ramping up capacity at its Songjiang 8-inch fab in Shanghai. Monthly capacity at the facility has come to nearly 110,000 8-inch wafers from the previous 90,000 units.

UMC has also moved to expand its 8-inch production capacity in China. Subsidiary Hejian Technology will build an additional capacity of 11,000 8-inch wafers bringing its total monthly capacity to nearly 60,000 units.