One big questions for example is that if FD-SOI is so good, why isn't Intel doing it? The site explains that as an integrated device manufacturer, Intel had to make a choice in 2004 between FinFET or planar FD-SOI. The latter wasn't even a real choice at that point so the chip giant went FinFET.
Chenming Hu, professor of microelectronics at University of California, Berkeley, wrote papers on FinFETs and ultra-thin body silicon on insulator (UTB-SOI) as early as the late 1990’s. Hu, chief technology officer of TSMC between 2001 and 2004, recently wrote in Advanced Substrate News, “When we first invented the [FD-SOI] concept in 2000, the availability of SOI substrates [that requires a very thin top layer of silicon] was the major obstacle. The final silicon layer thickness had to be about a quarter to a third of the gate length.”
As an integrated device manufacturer, Intel had to make a choice in 2004 between FinFET or planar FD-SOI. At that point, FD-SOI wasn’t even a real choice.
Hu noted, later, “Soitec has surmounted the wafer challenge and with that, commercial production can now become a reality,” but that reality didn’t really arrive until a few years ago. For fabless chip companies, FD-SOI is a real choice today. But for Intel, that train has already left the station.