AMD uses new packaging

Posted on Saturday, March 25 2006 @ 9:11 CET by Thomas De Maesschalck
DailyTech reports AMD has switched their packaging internals from the green biodegradable material to plain white cardboards because the old packaging material caused several problems.
Sources close to AMD have informed us that the company is quietly upgrading its packaging for processors, which previously caused some problems for end users. Anyone who has received AMD Retail PIB (Processor in Box) processors is surely familiar with the infamous "green" biodegradable packaging material that was used to stabilize the processor and the HSF. The infamy of this packaging material was based on numerous accounts of the material destroying itself during shipping, leaving a fine green powder or chunks of it across the processor, heatsink and fan.
More info and photos over here.

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