The idea is to disassemble a mobile phone by a heat-activated mechanism without any contact. By using a centralized heat source like laser heating, the shape memory alloy (SMA) actuator is activated, and the mobile phone covers are opened. The battery, display, printed wiring board (PWB) and mechanical parts are separated and can then be recycled in their material specific recycling processes. The required temperature for the disassembly is 60-150 ºC.More info at DailyTech.
Nokia invests self destruct phone
Posted on Monday, July 31 2006 @ 12:50 CEST by Thomas De Maesschalck