Nokia invests self destruct phone

Posted on Monday, July 31 2006 @ 12:50 CEST by Thomas De Maesschalck
Nokia is looking for a new cost effective way to recycle phones:
The idea is to disassemble a mobile phone by a heat-activated mechanism without any contact. By using a centralized heat source like laser heating, the shape memory alloy (SMA) actuator is activated, and the mobile phone covers are opened. The battery, display, printed wiring board (PWB) and mechanical parts are separated and can then be recycled in their material specific recycling processes. The required temperature for the disassembly is 60-150 ÂșC.
More info at DailyTech.


About the Author

Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.



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