VIA preparing KT/KM960 chipset for AMD AM2+

Posted on Monday, November 06 2006 @ 10:57:01 CET by Thomas De Maesschalck
HKEPC writes VIA is working on a new unified chipset for AMD's AM2+ platform.
According to a friend from main board manufacturing market, VIA has scheduled its next-generation unified chipset for AMD platform in 2H07. As a unified chipset, the new model would help VIA to fight in the value market more effective by a lowered cost. Further, supporting Hyper-Transport 3.0 means the chipset is also ready for AMD AM2+ processors.

In fact, VIA’s competitors NVIDIA and ATI have already announced their unified chipset in the earlier time, where NVIDIA has introduced unified design in MCP61 and ATI’s SC780 would come in 2H07. Unified chipset is a marketing trend for the value market that no one could deny, said a friend from the market. VIA’s move is just following the trend, and there will be 2 chipsets released from VIA for AMD platform. These new models include KT960 and KM960 which has build-in Chrome9 HD IGP的KM960. They are in unified design, which helps in lowering the cost..
More details over here.


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Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.



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