HKEPC has come across VIA’s latest roadmap that outlines plans throughout 2007. The roadmap appears to be very similar to the previous VIA roadmap. Nevertheless the latest roadmap lists two new VIA products—the KT960 and KM960. These new chipsets are expected to begin sampling in Q3 2007 with a Q4 2007 mass production schedule. This will be a brand new solution that differs from VIA’s current K8T890 and KM960 chipsets.
The upcoming KT960 and KM960 will be single-chip solutions instead of the traditional north and south bridge designs of VIA’s current and previous chipsets. VIA’s KT960 will be compatible with AMD’s current HyperTransport 1.0 and upcoming HyperTransport 3.0 protocols. It appears VIA is catering the KT960 towards the value sector as PCI Express support appears to be limited with support for one PCI Express x16 and two x1 slots.