TSMC to expand 65nm and 90nm capacity

Taiwan Semiconductor Manufacturing Company (TSMC) today held a meeting of its board of directors, which approved capital appropriation of US$1.133 billion to expand 65 and 90 nanometer process capacity in 300mm wafer fabs, according to a company filing with the Taiwan Stock Exchange (TSE).

The board of directors at TSMC also approved capital appropriation of US$9.2 million to expand 1.0 micron high voltage process capacity in Fab 2, Lora Ho, spokesperson and vice president said in the filing.