Taiwan Semiconductor Manufacturing Company (TSMC) today held a meeting of its board of directors, which approved capital appropriation of US$1.133 billion to expand 65 and 90 nanometer process capacity in 300mm wafer fabs, according to a company filing with the Taiwan Stock Exchange (TSE).
The board of directors at TSMC also approved capital appropriation of US$9.2 million to expand 1.0 micron high voltage process capacity in Fab 2, Lora Ho, spokesperson and vice president said in the filing.
TSMC to expand 65nm and 90nm capacity
Posted on Saturday, Nov 11 2006 @ 06:12 CET by Thomas De Maesschalck
Earlier this week TSMC announced it will expand its 65nm and 90nm production capacity: