AMD's Spansion signs patent license agreement with Rambus

Posted on Tuesday, Jan 16 2007 @ 15:00 CET by Thomas De Maesschalck
Rambus and Spansion announced today that they have signed a patent license agreement. This five-year, royalty-based agreement grants Spansion a license to a broad range of Rambus patents. Rambus management does not expect revenue generated from this license agreement to be material. Specific terms of the agreement are confidential.

"This license agreement with Rambus enables Spansion to expand our memory solutions for cellular phone applications," said Robert Melendres, executive vice president and chief legal officer at Spansion. "Working with the Rambus team to secure access to their patent portfolio will provide us more design freedom as we develop next generation Flash memory technology and solutions."

Spansion joins a growing list of semiconductor suppliers and system manufacturers who have signed patent license agreements for various products covered by Rambus patents. Other companies include AMD, Elpida, Fujitsu, Qimonda, Matsushita, NEC, Renesas, and Toshiba.


About the Author

Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.



Loading Comments