In WLP technology, the die and package are manufactured and tested on the wafer prior to singulation, making it different from all other package types. Accordingly, the area the package occupies when mounted onto a printed wire board or other substrate is the size of the die.
Hynix said its WLP technology enables it to reduce production costs by more than 20 percent. It added that the new module is highly stable in operation, and its heat emission, speed and power characteristics have been improved, making the module fit for devices requiring higher-speed data transfers.
Hynix claimed its DDR2 doesn't need the pins that are normally required for interconnection with other components, which decreases signal delays and increases the operating speed.
Hynix debuts 2GB 800MHz DDR2 memory module
Posted on Saturday, Jan 27 2007 @ 04:36 CET by Thomas De Maesschalck