Processors: 3D integration discussed

Posted on Monday, May 14 2007 @ 2:07 CEST by Thomas De Maesschalck
RealWorldTech published a fairly technical article this week that discusses all the aspects of 3D integration and its implications for processor performance. ARS Technica just published a more summarized version of this article.

Here's a snip:
Since the beginning of the integrated circuit, chips have been 2D affairs. A network of transistors and wires is etched on a square sliver of silicon, and as fabrication technology improves, those transistors and wires get ever smaller. But as transistors get smaller and more of them are crammed into the same-sized square of silicon, the relative distance between them grows larger. To see what I mean, consider two 1µm (micrometer) transistors joined by 1mm of wiring. A signal that travels from one transistor to the other will cross a distance equivalent to 1,000 transistor lengths..


About the Author

Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.



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