Intel has plans to shrink its Penryn processors to support smaller designs, so they can be incorporated in small form factor (SFF) systems:
Penryn will have two versions for its BGA packaging, LV and ULV, which will see die sizes shrink from the 35mm squared of previous Merom processors to 22mm squared. This will assist SFF products in becoming even smaller, the sources explained. Penryn will launch first as a 35mm square SV version in the second quarter of 2008, the sources added, while the LV and ULV are scheduled for the second half.
The site also reports that the Intel Montevina Centrino platform will be launched in the second quarter of next year. The Montevina platform will feature 45nm Penryn CPUs, Cantiga GM/PM Northbridge chips, the ICH9M southbridge and support for the Echo Peak WiFi/WiMAX module and the 802.11 WiFi module Shirley Peak.
Montevina will support DDR2 and DDR3 memory and will support DisplayPort and HDMI/HDCP.