Posted on Monday, October 15 2007 @ 18:14 CEST by Thomas De Maesschalck
The first technology uses compressor technology similar to that used in refrigerators and airco systems:
The compressor on display was a cylinder about 2cm in diameter and 10cm long and Eden showcased a notebook stand and cooling system containing three compressors which he claimed can reduce notebook chassis temperatures by around 10-degrees Celsius. Eden also showed how the compressors can be incorporated directly with a notebook's heatsink and fan assembly to be installed internally in the system.The second notebook cooling technology involves a new material that is permeable to air but not to liquids. This material will allow notebook makers to create notebooks that take in cool air through the keyboard rather than from small vents on the rear or underside of the unit.
Such a design has several advantages, particularly in giving designers more flexibility in terms of the layout of the motherboard and components, and it should improve cooling as the keyboard offers a larger surface area for air intake and is less likely to become blocked or covered.
