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DFI LANParty UT 790FX-M2R motherboard launched

Posted on Thursday, November 22 2007 @ 19:09:01 CET by


DFI released a new motherboard based on the AMD 790FX chipset - the LANParty UT 790FX-M2R.
Merged with ATI, AMD is now showing its muscle-790FX to the public. It is a cutting-edge technical show case from both AMD and ATI. It supports a new powerful technology, the “3-way CrossFire”. From now on, DFI 790FX can support a total of 3 CrossFire VGA cards at the same system anytime. By the way, the PCIE2.0 provides a faster and wider bandwidth between GPUs, and it can push the maximum speed up to 16GB/s. Besides, each of PCIE2.0 slots can supply a higher voltage then ever. The highest grade VGA cards such like ATI 2900 also have very solid power supporting capacity now, and they surely support the earlier PCIE 1.0 too. This is such a good news to all gamers.

LANParty UT 790FX-M2R provides a brand new FSB technology, the Hyper Trsansport3.0, which maximizes the bandwidth up to 41.6GB/s. This is a very significant functionality while CrossFire is at working. It needs a wider and faster bandwidth to accelerate the data transportation.

The digital PWM has been surely a powerful feature for CPU's power supplying since DFI firstly introduced it to enthusiast world. The PWM that LANParty UT 790FX features this time is quite different to others. It is a 7-phase PWM, which contains 6-phase for processor and a particularly 1-phase for Northbridge. The extra 1-phase PWM is an independent electricity power to support Northbridge. That makes the overclocking ability more flexible in voltage options.

DFI LP UT 790FX-M2R has equipped the powerful weapon ”Transpiper” too; a heat pipe sub- assembly, an extended design from Southbridge, Northbridge and now to PWM. The design of it is unique to any others in market. The, Transpiper servers as an extension joint to carry the heat out from the chassis. The Transpiper can be extended to the outside of the PSU fan. So that can carry out the heat from the Transpiper. This is magnificent technical breakthrough that takes the heat out of the chassis to prevent system overheat. These certainly increase the stability. Last, but not the least the thermal paste that used in our board is an advance-level product for better heat –dissipation; DFI is generous and willing to spend the 4 times higher cost than others in market, to provide the best for our customer.



 



 

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