Posted on Wednesday, Dec 19 2007 @ 07:15 CET by Thomas De Maesschalck
Major changes are expected in 2010 and 2011 as the industry moves into 45nm fabrication, 450mm wafer, 45 micro metre wafer thickness and 3D chip packaging technology. There are many concerns made by companies when technology goes through a paradigm shifts, mostly related to the costs of equipment replacement or retooling, and the degradation of electrical properties in some materials at 45nm or smaller.
As the industry moves into 45nm and beyond, there will be more electrical resistances and electronic scattering effects. As circuitry dimension is reduced, electricity has more trouble flowing because of greater resistance in the smaller copper wiring, raising the risk of defects or compromising signal integrity.
Read more at Bit Tech