Infineon ships first samples of 2GB DDR2 Planar Registred Memory Modules

German memory maker Infineon announced that is has shipped the first samples of its 2GB DDR2 Planar Registered memory modules. These modules use single-die 512Mbit DDR2 memory chips in very compact FBGA packages and are based on a planar design. Currently available modules with densities greater than 1GB use stacked-die.

Infineon’s new planar solution for 2 GB modules is based on mature single-die components. System manufacturers will benefit from considerably flatter modules which with a thickness of 4.1 mm fulfil the requirements for DDR2 server applications and depending on the respective system configuration result in up to 10 percent reduced heat generation. The 2 GB DDR2 Planar Registered DIMM, which is expected to become the preferred density of high-end server suppliers, targets high-performance data processing and storage applications in the server and storage infrastructure market. According to market research firm iSuppli the demand for mid-end and high-end servers units will increase from around 800,000 units in 2003 to approx. 1 million units in 2006 with an average growth rate of 9 percent per year. This new 2 GB Registered DIMM uses 36 single-die 512 Mbit DDR2 components in JEDEC (Joint Electronic Device Engineering Council) compliant 60-ball FBGA packages which operate at speeds of 400 Mbit/s and 533 Mbit/s. With the introduction of the 2 GB DDR2 Planar Registered DIMM, Infineon optimizes its DDR2 standard portfolio of registered modules with memory densities of 256 MB, 512 MB, 1 GB, 2 GB and 4 GB. Each DIMM except the 4 GB module is based on a planar design.

Samples of the 2 GB DDR2 Planar Registered DIMM are available in an organization of 256 Mbit x 72 (2 Rank x4), for speeds of PC2-3200 and PC2-4300 at unit prices from US-Dollar 700,- to 910,-. Volume production is planned to start in the second half of calendar year 2004