33-Way Thermal Interface Material Comparison

Posted on Thursday, Mar 06 2008 @ 08:12 CET by Thomas De Maesschalck
Benchmark Reviews has seen a lot of products made for the purpose of delivering better performance. Some of these products exist for overclockers and enthusiasts, and often times help deliver performance out of otherwise tame hardware. Other products sometimes only deliver the empty marketing claim of improvements. Of all the products we have seen and tested, one particular category always stands out as the culprit for over-hyped promises: Thermal Interface Material (TIM). Of all the heatsink compounds and thermal pastes made and marketed, they must all only concentrate themselves to deliver the simple function of mating the CPU to the cooler with the highest thermal conductivity possible. Of course, some work better than others, and this is exactly what Benchmark Reviews intends to discover. Please join us for a comprehensive testing of 33 different TIM products.

Check it out over here.


About the Author

Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.



Loading Comments