DV Hardware - bringing you the hottest news about processors, graphics cards, Intel, AMD, NVIDIA, hardware and technology!

   Home | News submit | News Archives | Reviews | Articles | Howto's | Advertise
DarkVision Hardware - Daily tech news
January 22, 2018 
Main Menu
News archives

Who's Online
There are currently 101 people online.


Latest Reviews
Arctic BioniX F120 and F140 fans
Jaybird Freedom 2 wireless sport headphones
Ewin Racing Champion gaming chair
Zowie P-TF Rough mousepad
Zowie FK mouse
BitFenix Ronin case
Ozone Rage ST headset
Lamptron FC-10 SE fan controller

Follow us

Intel Nehalem to boost FC substrate growth

Posted on Monday, March 17 2008 @ 00:30:27 CET by

DigiTimes reports the upcoming Intel Nehalem processors will spur demand for flip-chip (FC) substrates.
Of the Nehalem lineup, Bloomfield, which will pack the processor and memory controller, as well as possibly more northbridge functions such as a GPU in a multi-chip-package (MCP), will demand more substrate layers, implying a larger size of substrate.

Besides the stronger integration requiring more substrate layers, 45nm process made ICs have a thinner line-width and more complicated structure, which also grows demand for more substrates, the industry players commented. Additionally, the Ibexpeak platform controller hub (PCH), which replaces the traditional southbridge in the Nehalem platform, features a new system-on-chip (SoC) design which will also require more substrates, the industry players remarked.



DV Hardware - Privacy statement
All logos and trademarks are property of their respective owner.
The comments are property of their posters, all the rest © 2002-2017 DM Media Group bvba