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Intel Nehalem to boost FC substrate growth

Posted on Monday, March 17 2008 @ 00:30:27 CET by


DigiTimes reports the upcoming Intel Nehalem processors will spur demand for flip-chip (FC) substrates.
Of the Nehalem lineup, Bloomfield, which will pack the processor and memory controller, as well as possibly more northbridge functions such as a GPU in a multi-chip-package (MCP), will demand more substrate layers, implying a larger size of substrate.

Besides the stronger integration requiring more substrate layers, 45nm process made ICs have a thinner line-width and more complicated structure, which also grows demand for more substrates, the industry players commented. Additionally, the Ibexpeak platform controller hub (PCH), which replaces the traditional southbridge in the Nehalem platform, features a new system-on-chip (SoC) design which will also require more substrates, the industry players remarked.



 



 

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