In return, the SFF-SIG will draft a formal specification document and promote it with the goal of broadening the number of suppliers and customers who build and purchase Pico-ITX-compatible single board computers (SBCs). The SFF-SIG intends to publish a specification within the next few months.
As a worldwide organization that seeks to identify and standardize appropriate small form factor technologies and building blocks, SFF-SIG sees Pico-ITX as an ideal platform for the new ultra mobility CPUs and chipsets, highlighting the key benefits of smaller size, reduced power consumption, and greater reliability over larger legacy products.
“Based on the positive customer interest and feedback so far, we see a good opportunity to rapidly build the market for Pico-ITX by working with the SFF-SIG to standardize it,” said Daniel Wu, vice president, VIA Technologies, Inc. “Pico-ITX was developed to meet the evolving needs of the rapidly-expanding embedded industry, and its adoption by the SFF-SIG will enable more concerted development of the specification and its infrastructure.”
“Adopting Pico-ITX is the first step toward creating a unified embedded platform for ultra mobility silicon,” said Colin McCracken, president, Small Form Factor SIG. “Our next order of business is to define the SUMIT™ expansion interface. OEMs have requested both high-speed and low-speed serial buses for space efficiency, with an emphasis on low power and easy connectivity. We are working with chipset vendors to determine how ultra mobility silicon can best meet these needs over a ten year time horizon.”
Companies interested in contributing to the development of the Pico-ITX specification, or in defining other SBCs and computer-on-modules for the new ultra mobility CPUs and chipsets should contact the SFF-SIG at: info@sff-sig.org.