Intel Nehalem socket to be bigger and more robust

Posted on Tuesday, April 08 2008 @ 0:00 CEST by Thomas De Maesschalck

The Inquirer reports the LGA1366 socket for Bloomfield and Gainestown processors will be about 20% bigger on each side and also a lot more robust. The socket will feature a metal backplate and there will also be an improved retention mechanism.

Take a look at this LGA1366 test board for the Bloomfield. While the front CPU socket insertion seems the same as right now, the back portion has a proper metal back plate which, via four screw holes, holds the CPU socket firmly without banding under, say, heavy fans.

But, hold on, at a second glance, even the front isn't really the same - there's an independent loading mechanism - ILM - instead of the direct socket loading used right now. Take a look at the mounting process from these slides.

More pics over here.

About the Author

Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.

Loading Comments

Share this story!