Posted on Thursday, April 24 2008 @ 4:03 CEST by Thomas De Maesschalck
TSMC outlined details about its 32nm process, including the introduction of a high-k and metal-gate offering:
Last week, IBM Corp. and its technology alliance took the lead in the heated public relations battle by announcing the availability of a high-k and metal-gate offering for foundry customers at the 32-nm node.
Silicon foundry giant TSMC has been quiet about its efforts in the arena--at least until now. ''We will have high-k and metal-gate at 32-nm,'' said Rick Tsai, president and chief executive of the company, during a keynote at its 2008 Technology Symposium here.
Jack Sun, vice president of research and development, indicated that TSMC will provide various enabling options at the 32-nm node. For its 32-nm low-power process, the company plans to develop a third-generation triple-gate oxide technology.
Source: EE Times
