Intel has told motherboard makers that a manufacturing fix for the ICH6 problem in some of the Grantsdale chipsets will be available in July.
Intel said that the initial ICH6 component in the Grantsdales had what's called a fab "excursion" in the jargon of the chip trade.
The early production samples showed a susceptibility to excessive pad leakage in the RTC circuit, and some parts from those early lots were passed through the initial screening test and went into production.
Intel told its customers that a more stringent test screen has now been implemented in its factories, and it expects to ship the manufacturing fix next month.
All product released after June 14th is free of the problem, and Intel is going to give top side mark information to allow customers to tell excursion from non-excursion material.
But it recommends that its customers hold the previous lots as it investigates how useable they may be.