Transcend unveiled retail DDR3-1066 and DDR3-1333 memory modules this week:
Transcend’s DDR3-1066 and DDR3-1333 DIMMs are made of high-quality 128Mx8 DDR3 DRAM chips and use robust PCBs that meet JEDEC（the Joint Electron Device Engineering Council）standards. Each chip is selected with the strictest quality and performance standards and is manufactured using small Fine-Pitch Ball Grid Array (FBGA) packages with extra contacts to assure better thermal dissipation, electrical efficiency and reliable computing quality at high clock frequencies. In addition, DDR3 memory modules incorporate all-new “Fly-by” architecture that provides more efficient direct communication between the controller and each DRAM chip. This new architecture also includes dynamic On-DIMM Termination to minimize signal reflections at higher speeds.
New “Fly-by” circuitry allows speed and stability at high clock