DigiTimes has an article about the future of chip manufacturing, the focus of the article is Through Silicon Vias (TSV), a more advanced off-chip interconnect scheme that provides much shorter path lengths and lower resistance and inductance than bond wire structures for signal and power delivery. Here's a snip:
In the TSV design, the chips are stacked on top of each other but instead of using wire bonding, each silicon via is etched in a manner that passes through all the layers. A material such as copper is then used to fill in the vias and function as interconnects, thus connecting all the chips into one.
TSV has the potential to facilitate cheaper development costs than that for SoC, while delivering better performance than SIP. TSV delivers advantages such as shortening the distance between circuitry without any limitations being set for how many dies can be stacked. Therefore, a TSV-made device with enhanced speed and performance is more suitable for smaller devices.