DV Hardware - bringing you the hottest news about processors, graphics cards, Intel, AMD, NVIDIA, hardware and technology!

   Home | News submit | News Archives | Reviews | Articles | Howto's | Advertise
 
DarkVision Hardware - Daily tech news
January 16, 2018 
Main Menu
Home
Info
News archives
Articles
Howto
Reviews
 

Who's Online
There are currently 107 people online.

 

Latest Reviews
Arctic BioniX F120 and F140 fans
Jaybird Freedom 2 wireless sport headphones
Ewin Racing Champion gaming chair
Zowie P-TF Rough mousepad
Zowie FK mouse
BitFenix Ronin case
Ozone Rage ST headset
Lamptron FC-10 SE fan controller
 

Follow us
RSS
 

Intel, IBM working on co-polymer lithography

Posted on Monday, September 29 2008 @ 11:01:32 CEST by


EE Times reports several firms, including IBM and Intel, are exploring a new technology called co-polymer lithography:
Scientists at the University of California at Santa Barbara (UCSB) and the National Science Foundation (NSF) have also made a major contribution to this field. UCSB claims to have developed a novel, self-assembly process for creating features on silicon that are between 5- and 20-nm.

Intel, IBM, UCSB and NSB funded the R&D. The university has already applied for patents on the new methods and it will retain ownership.

"We've come up with this new blending approach, called block co-polymer lithography, or BCP," said Craig Hawker, materials professor and director of the Materials Research Laboratory at UCSB, in a statement. "It essentially relies on a natural self-assembly process. Just like proteins in the body, these molecules come together and self assemble into a pattern. And so we use that pattern as our lithographic tool, to make patterns on the silicon wafer."




 



 

DV Hardware - Privacy statement
All logos and trademarks are property of their respective owner.
The comments are property of their posters, all the rest © 2002-2017 DM Media Group bvba