Mushkin debuts Ascent DDR2 and DDR3 memory with eVCI cooling

Posted on Friday, October 03 2008 @ 5:22 CEST by Thomas De Maesschalck

Mushkin unveiled a new line of Ascent DDR2 and DDR3 memory modules with copper enhanced vapor chamber interface (eVCI) cooling. The firm claims eVCI conducts heat 10x better than solid copper:

Copper enhanced Vapor Chamber Interface (eVCI) provides an extremely conductive thermal path from the DRAM (10X better than solid copper)

Highly conductive 6063 extruded aluminum alloy encasement for effective heat exchange through convection

Low profile and slim width design for full population of memory slots if desired. Won’t interfere with most large CPU heatsinks

Sleek and aggressive design compliments any build’s appearance

More info Mushkin.

About the Author

Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.

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