Intel showed off a prototype of the upcoming Moorestown mobile platform which is slated to arrive in the 2009-2010 timeframe.
Moorestown comprises of an SOC, codenamed "Lincroft," which integrates the 45nm processor, graphics, memory controller and video encode/decode onto a single chip and an I/O hub codenamed "Langwell", which supports a range of I/O ports to connect with wireless, storage, and display components in addition to incorporating several board level functions. Chandrasekher stated that Intel is on track to reduce Moorestown platform idle power by more than 10x compared to the first-generation MIDs based on the Intel Atom processor.
Chandrasekher said that Moorestown will be a catalyst for exciting and innovative developments that will extend the full Internet experience into the smartphone space with the Communication MID. He indicated that Moorestown platforms will support a range of wireless technologies including 3G, WiMAX, WiFi, GPS, Bluetooth and mobile TV. Additionally, Chandrasekher announced a collaboration with Ericsson* for HSPA data modules optimized for the Moorestown platform. He also announced that Option* is extending its collaboration for HSPA modules to the Moorestown platform. These 3G modules come in 25x30x2.x mm small size, are optimized for Moorestown power requirements and will help provide MID users with more powerful, always connected Internet-based experiences.