Six weeks from now Intel will unravel its 32nm processor process technology at the IEEE International Electron Devices Meeting in San Francisco on December 15. Taiwanese foundry TSMC will also show off a 32nm SRAM chip and IBM partnered with AMD to present the first 22nm high-k and metal gate SRAM cell.
Representatives from the chip giant will be presenting a paper at the IEEE International Electron Devices Meeting (IEDM), which kicks off in San Francisco on 15 December. They will discuss how they produced a 291Mb SRam memory array to test the process, which uses high-k and metal gate technologies. It has a density of 0.171ì², EE Times reports.
But we can add that Intel won't be the only chip maker detailing its progress to the 32nm node. Semiconductor foundry TSMC will be present to discuss its 32nm 2Mb SRam chip, while IBM boffins will be presenting its 0.157ìm² 32nm SRam cell.
IBM will also be partnering with AMD to present what they claim is the "smallest functional SRam cell ever made" - a 22nm high-k and metal gate part with a cell density of 0.1ìm²
Don't get too excited about the 22nm though, it's just a proof of concept, AMD is expected to deliver its first 22nm processors in 2012.
Intel on the other hand has plans to debut its 32nm shrink of Nehalem in late 2009, these chips are codenamed "Westmere".