Rambus, a developer of chip interface products and memory, showcased functional XDR DRAM memory subsystems for the first time in history. While it is still remains to be seen whether the industry will try to taste Rambus again after RDRAM, the demonstration clearly indicates that Rsmbus' technologies are mature enough to be exposed and implemented into applications.
XDR memory’s novel system topology allows point-to-point differential data interconnects to scale to multi-gigahertz speeds, while the bussed address and command signals allow a scalable range of memory system capacity supporting from 1 to 36 DRAM devices. XDR DRAMs will be available in multiple speed bins, device densities, and device widths. With densities ranging from 256Mb to 8Gb, and device widths ranging from x1 to x32, XDR DRAM satisfies the needs of both high-bandwidth and high-capacity systems, the company indicated.