EE Times reports fab-tool trade group SEMI will host a meeting next month that will involve 450mm silicon wafer standards:
As reported, after several competing proposals, Sematech and the IC industry have settled upon a wafer thickness standard of 925-micron, plus or minus 25-micron, for the so-called ''mechanical standard'' for 450-mm silicon wafers. The ''mechanical standard'' is an early and preliminary standard. In comparison, a 300-mm wafer has an overall thickness of 775-micron.
Then, in November, the industry will take the next step. It will vote upon a ''test wafer thickness'' standard for 450-mm wafers.