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DRAM production to shrink further in early 2009

Posted on Monday, November 17 2008 @ 07:16:31 CET by

DRAM manufacturers have been cutting production since September 2008, and DigiTimes reports more cuts are expected in Q1 2009:
The sources indicated that ProMOS Technologies plans to have a long annual maintenance period of one month beginning in January next year, while Nanya Technology will stop its 12-inch production in January, to be resumed in February using Micron technologies.

Powerchip Semiconductor Corporation (PSC) has scheduled a two-week annual maintenance period during the Chinese New Year holidays in January, the sources added. The sources estimate a sequential drop of about 6%, or 70,000 wafers (12-inch equivalents), in overall DRAM output during the first quarter of 2009.

Nanya has remarked that the company plans to start converting its capacity to 68nm stack technology in December 2008. During the process of upgrading its equipment, Nanya will do its best to avoid its production from being affected, the company said.



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