Mobile chip maker ARM is showing off its fist 32nm Cortex processors at the Mobile World Congress in Barcelona, these chips use 32nm High-K Metal Gate (HKMG) process technology. They are expected to show up in mobile phones in early 2010.
It is the first ever 32nm Cortex™ family processor core, built with ARM Physical IP, on a test chip from the IBM Common Platform in its 32nm High-K metal gate (HKMG) process. This achievement will support ARM® semiconductor Partners in developing the market’s most competitive power, performance and area benefits alongside quicker time-to-market for product releases. ARM Partners will have access to the technology in 2009, with full production release in early 2010.
ARM is developing customized Physical IP targeted at achieving optimal power, performance and area for current and future Cortex processors, utilizing the unique attributes of the Common Platform 32/28nm HKMG technology. The 32nm chip demonstrates ARM’s commitment to early engagement with advanced processes, paving the way for ARM Partners to rapidly deploy products incorporating ARM technology on 32nm/28nm.
This development follows nine months of collaboration between ARM and the Common Platform. The successful test chip demonstrates that the critical technologies are proven and is an important stepping stone towards implementing the Cortex-A9 and future processors at advanced process nodes.
“This silicon proof is a key step in our roadmap to demonstrate the technical synergy between leading ARM processors, ARM Physical IP and the Common Platform process technology that delivers best-in-class performance, lowest power consumption and rapid time-to-market,” said Ian Drew, EVP Marketing, ARM. “It also shows that we are fully committed to affording our Partners the earliest possible opportunity to deploy ARM technology, in particular the Cortex-A9 processor and future processors, on the 32/28nm process.”
The chip comprises an ARM Cortex family processor implemented with ARM Physical IP prototype libraries as well as diverse test structures targeted at validating key technologies. ARM will develop and license an IP design platform including logic, memory and interface products, providing the opportunity for ARM and the IBM Common Platform to optimize products, reduce risk and improve time-to-market.
“Our collaboration on advanced 32/28nm process technology with ARM will ensure rapid deployment of this best-in-class technology for our customers,” said Dr. Seung-Ho Hwang, Sr. VP of Infrastructure Design at Samsung Electronics. “We are committed to producing next-generation products with advanced, attractive features and longer battery life. ARM technology will help drive Samsung’s product development of innovative, energy-efficient, high-performance products now and in the future.”