Texas Instruments showed off its second generation Pico projector at the Mobile World Congress in Barcelona. The new module is about 20 percent thinner and smaller, and can project WVGA (854 x 480) DVD resolution images. The chipset as small enough to embed into most compact phones and gadgets, it will start shipping in late 2009.
"Building upon the success of the first DLP Pico chipset, which has HVGA resolution and enables leading brands to deliver cutting-edge products across the globe, this new chipset increases performance benchmarks," said Frank J. Moizio, Manager, DLP Emerging Markets business. "The new chipset provides WVGA resolution, higher brightness and power efficiency; all while enabling thinner, smaller optical engine modules to meet the demands of contemporary handheld devices."
DLP Pico projection products were featured at the International Consumer Electronics Show in January and regarded by industry analysts as one of the hottest new categories in consumer electronics. According to U.S. based research group Pacific Media Associates (PMA), the market for such devices is expected to surpass millions of units in the next few years.
First introduced at Mobile World Congress last year, several global partners have already launched products built on DLP Pico technology ranging from notebook companions to handheld media players and mobile phones.
The newest DLP Pico chipset can be paired with a TI OMAP application processor to deliver the ultimate mobile user experience. The DLP Pico chipset is a combination of the DLP Pico chip and the DLP Pico processor. It is optimized for applications in mobile and handheld devices.
The new DLP Pico solution delivers the following features:
- WVGA (854x480) - Native DVD resolution
- Enables >20% thinner optical module height
- Enables >20% smaller optical module volume
- Incorporates technology advances that increase both brightness and power efficiency
- Enables industry leading contrast ratio of better than 1000:1
- Impressive full RGB color gamut