Posted on Thursday, February 26 2009 @ 2:18 CET by Thomas De Maesschalck
X-bit Labs
reports Micron is shutting down its 200mm wafer DRAM facility in Boise, Idaho. About 500 jobs will be cut in the near term, and as many as 2,000 positions may be axed by the end of Micron's fiscal year.
“We remained hopeful that the demand for these products would stabilize in the marketplace and start to improve as we moved into the spring. Unfortunately, a better environment has not materialized, and we are at a point where we wanted to let our employees and the community know in advance what will occur later this summer,” said Steve Appleton, Micron chairman and chief executive.
Since 200mm wafers are no longer used for manufacturing of high-end products, Micron utilized the facility to make so-called “200mm specialty” dynamic random access memory products, which most likely means that memory products and types made at the fab were outdated.
The 300mm research and development fabrication facility at the Boise site will continue operating.
