Posted on Sunday, March 29 2009 @ 3:27 CEST by Thomas De Maesschalck
In October last year Intel released processors based on the socket 1366 architecture and with these came a requirement for redesigned heatsink install methods. Essentially the distance between corners of the heatsink increased (as did the processor footprint) and existing high end coolers were no longer compatible with new motherboards.
Some manufacturers have managed to rework their heatsink kits to include new components for 1366 compatibility while others have released new models for the Core-i7 processors and today we have four of these products on our test bench. Read more
at DriverHeaven.
