TSMC speeding up 12-inch fab expansion

Posted on Monday, Apr 13 2009 @ 19:39 CEST by Thomas De Maesschalck
DigiTimes reports TSMC is speeding up 12-inch (300mm) fab expansion:
Taiwan Semiconductor Manufacturing Company (TSMC) has completed fourth-phase expansion to its 12-inch facility, Fab 12, at the Hsinchu Science Park (HSP), where production at the 40nm and 45nm nodes takes place, according to equipment makers. The recently-expanded capacity will kick off operations at an initial output of 1,000-2,000 wafers.

TSMC has reportedly seen an influx of orders from Altera, AMD and Nvidia.

Company vice-president for human resources PH Chang confirmed that TSMC is preparing to hire several hundreds of new engineers for newly-added advanced process node capacity at its 12-inch wafer facilities.

About the Author

Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.

Loading Comments