Taiwan Semiconductor Manufacturing Company (TSMC) has completed fourth-phase expansion to its 12-inch facility, Fab 12, at the Hsinchu Science Park (HSP), where production at the 40nm and 45nm nodes takes place, according to equipment makers. The recently-expanded capacity will kick off operations at an initial output of 1,000-2,000 wafers.
TSMC has reportedly seen an influx of orders from Altera, AMD and Nvidia.
Company vice-president for human resources PH Chang confirmed that TSMC is preparing to hire several hundreds of new engineers for newly-added advanced process node capacity at its 12-inch wafer facilities.
TSMC speeding up 12-inch fab expansion
Posted on Monday, Apr 13 2009 @ 19:39 CEST by Thomas De Maesschalck