Posted on Friday, July 31 2009 @ 20:41 CEST by Thomas De Maesschalck
TSMC CEO Morris Chang
announced the foundry has seen yields on its 40/45nm processes increase to around 60 percent, up from 30 percent earlier this year. Chang also added that TSMC is scheduled to ramp 32nm production in Q1 2010, with 28nm following between late 2010 and early 2011.
In response to TSMC's 40nm yield issues, Chang said rates have improved from 30% to 60%. The foundry expects to process around 30,000 wafers on 40nm in the third quarter, Chang noted.
TSMC revealed in its second-quarter financial report that 40/45nm has surpassed 1% of its total wafer sales, with shipments tripling from those in the first quarter. The company, in early July, also issued a statement announcing it had cumulatively shipped over five million 12-inch equivalent wafers processed with sub-0.13-micron processes, of which, several thousand were manufactured on 40nm.
