Taiwan Semiconductor Manufacturing Company (TSMC) is preparing a major capacity expansion at its 12-inch fabs to ramp up its 90nm process technology in 2005. The firm expects volume production for the cutting-edge process will “accelerate dramatically.”
TSMC expects that almost 40 single-product mask sets 30 other products on mask-sharing Cybershuttle wafers will have taped out before the end of 2004. Among these products, up to 10 have entered production and many others are either in qualification or design verification, the firm said in a December 29 press statement.
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TSMC to boost its 90nm capacity in 2005
Posted on Thursday, December 30 2004 @ 19:11 CET by Thomas De Maesschalck