TSMC to boost its 90nm capacity in 2005

Posted on Thursday, Dec 30 2004 @ 19:11 CET by Thomas De Maesschalck
Taiwan Semiconductor Manufacturing Company (TSMC) is preparing a major capacity expansion at its 12-inch fabs to ramp up its 90nm process technology in 2005. The firm expects volume production for the cutting-edge process will “accelerate dramatically.”

TSMC expects that almost 40 single-product mask sets 30 other products on mask-sharing Cybershuttle wafers will have taped out before the end of 2004. Among these products, up to 10 have entered production and many others are either in qualification or design verification, the firm said in a December 29 press statement.

Read more at DigiTimes


About the Author

Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.



Loading Comments