Taiwan Semiconductor Manufacturing Company, the world’s largest contract maker of semiconductors, plans to start testing 450mm wafer production equipment in 2010, according to market rumours. The decision is inline with the plan of the company to build a pilot 450mm production line by 2012.
DigiTimes web-site reports that TSMC maintains its plans regarding 450mm trial production in 2012 and is “cooperating closely” with equipment and material suppliers to push the advance to 450mm wafer production and believes that it will be able to test at least some of the actual 450mm production equipment already in 2010.
TSMC may start testing 450mm wafer production in 2010
Posted on Wednesday, October 07 2009 @ 1:00 CEST by Thomas De Maesschalck