While Intel has been introducing a new logic process generation every two years, it has recently been developing a System-on-a-Chip (SoC) process alongside each logic process. With the 32nm generation, Intel's SoC process technology is the most advanced of any reported 32nm or 28nm process in the industry. Intel's 32nm high-k/metal gate transistor technology has been optimized for SoC platform applications that span a wide range of power, performance, and features. This technology has been developed to be modular, offering mix-and-match transistors, interconnects, RF/analog passive elements, embedded memory, and noise mitigation options. The low gate leakage of the high-k gate dielectric enables the triple transistor architecture to support ultra low power, high performance, and high voltage tolerant I/O devices concurrently. Embedded memories include high density and low voltage SRAMs. Analog/RF SoC features include high precision and high quality passives (resistors, capacitors and inductors) and noise isolation. Details were presented last week at the International Electron Devices Meeting (IEDM).