Intel helps lead 450mm wafer initiative in Europe

Posted on Thursday, January 14 2010 @ 1:21 CET by Thomas De Maesschalck
EE Times reports European semiconductor manufacturing equipment firms have come together with Intel and research group IMEC to form a European 450mm wafer equipment and materials initiative, named EEMI-450.
The group has held a couple of meetings during 2009 and applied for funding under the ENIAC European nanotechnology program and under the European Union Framework Project 7 (FP7) as a so-called co-ordinated action.

The objective of the ENIAC EEMI-450 and CASA-450 programs is "to improve the competitiveness of the European semiconductor E&M [equipment and materials] industry and therefore increase the chances to be selected by the tier 1 semiconductor companies in their future 450-mm operations," according to a presentation from Bas Van Nooten, director of European cooperative programs for ASM International NV (Almere, The Netherlands), who has been acting as a spokesman for EEMI-450.

The projects are also expected "to stimulate a European infrastructure that is leading in 450-mm development and as a result will induce tier 1 companies to [join] cooperation programs and possibly equip 450-mm fabs in Europe," van Nooten added in the presentation.

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Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.

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