Winbond to start 40nm development this year

Posted on Tuesday, February 02 2010 @ 3:35 CET by Thomas De Maesschalck

DigiTimes reports Winbond will enter 40nm production this year:

Winbond Electronics has announced it will begin 40nm development in 2010, according to company president Chan Tung-Yi. The company declined to comment on whether it will cooperate with Elpida Memory in 40nm production.

Winbond's capex for 2010 is NT$6.7 billion (US$2009.15 million), a 50% increase compared to NT$4.2 billion of 2009, and includes expenses for 40nm development.

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Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.

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