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Winbond to start 40nm development this year

Posted on Tuesday, February 02 2010 @ 03:35:51 CET by

DigiTimes reports Winbond will enter 40nm production this year:
Winbond Electronics has announced it will begin 40nm development in 2010, according to company president Chan Tung-Yi. The company declined to comment on whether it will cooperate with Elpida Memory in 40nm production.

Winbond's capex for 2010 is NT$6.7 billion (US$2009.15 million), a 50% increase compared to NT$4.2 billion of 2009, and includes expenses for 40nm development.



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