Posted on Thursday, February 11 2010 @ 0:00 CET by Thomas De Maesschalck
Toshiba is reportedly planning to build a 800 billion yen (around US$8.9 billion) wafer fab to increase its NAND flash memory capacity.
When fully facilitized the wafer fab is expected to double Toshiba's NAND production capacity from about 260,000 wafers per month to 500,000 wafers per month, the reports said.
Toshiba is now expected to begin construction of the fab in Mie prefecture in the summer and to begin manufacturing operations in 2011, reports said. "The plan still exists, but we haven't decided yet when to start building the plant," a Dow Jones report quoted a Toshiba spokesman as saying. The decision on the exact timing is expected later this year and in time to allow construction to begin in 2010 in line with a previous Toshiba statement.
More info
at EE Times.
