Posted on Wednesday, February 24 2010 @ 2:01 CET by Thomas De Maesschalck
MSI will debut the WindBOXⅢ at next week's CeBIT:
For clients’ strong demand of ultra-low power platform with slim and fanless design, MSI upgrades the WindBOX to the third generation based on the Intel® Core™2 Duo Mobile Processor and the Mobile Intel® GS45 + ICH9M chipset to provide the latest ultra-low power and slim form factor into solid embedded applications.
WindBOX Ⅲ features great 3D graphics performance for a high definition up to 1080P. It supports directX10, shader model 4.0 and Intel® clear video technology. MSI enhances I/O connectivity covers multiple video output within HDMI and DVI-I interface in dual independent display. For the internet demand, WindBOX Ⅲ comes with a module that has a built-in WiFi 802.11b/g/n and blue-tooth module. With such solid capability, the MSI WindBOX Ⅲ is revolutionizing the traditional imagination of a low power and cost-effective segment.
The MSI WindBOX Ⅲ supports VESA wall-mount interface and various scenarios like digital signage, thin client, and POS with affordable expenditure, which not only fits the demand of Industrial applications but also qualifies for the request of companies, governments, and institutes for general using. Based on endless innovation, MSI keeps providing you more efficient and economical products and being with you to fulfill your demand.
