Posted on Friday, February 26 2010 @ 0:07 CET by Thomas De Maesschalck
EE Times had an interview with Shang-Yi Chiang, senior vice president of R&D at TSMC, about some of the issues the foundry experiences and plans for the future. You can read it
over here.
3. Progress at 28-nm
(Several months ago, TSMC rolled out its 28-nm, which will have several options.)
Chiang: ''The first node we're going to release for the 28-nanometer will be we call the 28 LP. This is our poly gate and silicon oxide nitrate version. We will establish production at the end of June this year, about four months from now, and this is for the low power application. Again, no high-k metal gate.''
