DV Hardware - bringing you the hottest news about processors, graphics cards, Intel, AMD, NVIDIA, hardware and technology!

   Home | News submit | News Archives | Reviews | Articles | Howto's | Advertise
DarkVision Hardware - Daily tech news
January 24, 2018 
Main Menu
News archives

Who's Online
There are currently 128 people online.


Latest Reviews
Arctic BioniX F120 and F140 fans
Jaybird Freedom 2 wireless sport headphones
Ewin Racing Champion gaming chair
Zowie P-TF Rough mousepad
Zowie FK mouse
BitFenix Ronin case
Ozone Rage ST headset
Lamptron FC-10 SE fan controller

Follow us

Intel improves cost-effectiveness of LGA775 HSF design

Posted on Monday, March 01 2010 @ 11:17:09 CET by

TC Mag spotted Intel will start shipping a slightly updated cooler for its boxed LGA775 processors starting April 1st, 2010.
The new model is set to come with multiple tweaks compared to the currently-used solution and these are:

- a slightly smaller impeller (fan speed is increased because of this but noise output stays the same)
- fan shroud hub diameter increased (from 34mm to 40mm) due to modifications to fan electronics
- heatsink fins will be straight (as opposed to curved as they are now)
- the heatsink will be a bit more compact (height decreased from 18.9 mm to 18.47mm)



DV Hardware - Privacy statement
All logos and trademarks are property of their respective owner.
The comments are property of their posters, all the rest © 2002-2017 DM Media Group bvba