Intel improves cost-effectiveness of LGA775 HSF design

Posted on Monday, March 01 2010 @ 11:17 CET by Thomas De Maesschalck
TC Mag spotted Intel will start shipping a slightly updated cooler for its boxed LGA775 processors starting April 1st, 2010.
The new model is set to come with multiple tweaks compared to the currently-used solution and these are:

- a slightly smaller impeller (fan speed is increased because of this but noise output stays the same)
- fan shroud hub diameter increased (from 34mm to 40mm) due to modifications to fan electronics
- heatsink fins will be straight (as opposed to curved as they are now)
- the heatsink will be a bit more compact (height decreased from 18.9 mm to 18.47mm)


About the Author

Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.



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