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Mushkin unveils DDR3 kits with Ridgeback Heatsink

Posted on Wednesday, March 03 2010 @ 19:00:45 CET by

Mushkin presents some new DDR3 memory kits with their new Ridgeback Heatsink cooling solution.
Mushkin Enhanced, a global leader in high-performance computer products, announced today the release of ‘Ridgeback', a new heatsink designed for the gaming and enthusiast communities. The initial series of Ridgeback kits will offer DDR3-1600 performance for Intel's LGA1366 and LGA1156 platforms at two different latency levels, as well as a DDR2-1066 solution. In the near future, kits for AMD's AM3+ and other platforms will be available.

"The Ridgeback Project has been an exciting project for both myself and our marketing department. We've worked hard to develop this world-class memory cooling solution. Ridgeback will help ensure that modules work well in intense, high-labor scenarios and will also look elegant in many types of installations," said Brian Flood, director of product development.

Part Numbers:
* 996826 - 4GB (2x2GB) PC3-12800 6-8-6-24 1.65V Ridgeback
* 998826 - 6GB (3x2GB) PC3-12800 6-8-6-24 1.65V Ridgeback
* 998827 - 6GB (3x2GB) PC3-12800 8-8-8-24 1.65V Ridgeback
* 996828 - 4GB (2x2GB) PC2-8500 5-5-5-15 2.1V Ridgeback

Source: TPU



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