Mushkin presents some new DDR3 memory kits with their new Ridgeback Heatsink cooling solution.
Mushkin Enhanced, a global leader in high-performance computer products, announced today the release of ‘Ridgeback', a new heatsink designed for the gaming and enthusiast communities. The initial series of Ridgeback kits will offer DDR3-1600 performance for Intel's LGA1366 and LGA1156 platforms at two different latency levels, as well as a DDR2-1066 solution. In the near future, kits for AMD's AM3+ and other platforms will be available.
"The Ridgeback Project has been an exciting project for both myself and our marketing department. We've worked hard to develop this world-class memory cooling solution. Ridgeback will help ensure that modules work well in intense, high-labor scenarios and will also look elegant in many types of installations," said Brian Flood, director of product development.