Mushkin unveils DDR3 kits with Ridgeback Heatsink

Posted on Wednesday, March 03 2010 @ 19:00 CET by Thomas De Maesschalck

Mushkin presents some new DDR3 memory kits with their new Ridgeback Heatsink cooling solution.

Mushkin Enhanced, a global leader in high-performance computer products, announced today the release of ‘Ridgeback', a new heatsink designed for the gaming and enthusiast communities. The initial series of Ridgeback kits will offer DDR3-1600 performance for Intel's LGA1366 and LGA1156 platforms at two different latency levels, as well as a DDR2-1066 solution. In the near future, kits for AMD's AM3+ and other platforms will be available.

"The Ridgeback Project has been an exciting project for both myself and our marketing department. We've worked hard to develop this world-class memory cooling solution. Ridgeback will help ensure that modules work well in intense, high-labor scenarios and will also look elegant in many types of installations," said Brian Flood, director of product development.

Part Numbers:
* 996826 - 4GB (2x2GB) PC3-12800 6-8-6-24 1.65V Ridgeback
* 998826 - 6GB (3x2GB) PC3-12800 6-8-6-24 1.65V Ridgeback
* 998827 - 6GB (3x2GB) PC3-12800 8-8-8-24 1.65V Ridgeback
* 996828 - 4GB (2x2GB) PC2-8500 5-5-5-15 2.1V Ridgeback

Source: TPU

About the Author

Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.

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