GlobalFoundries capacity expansions to close the gap with TSMC

After speaking at the Future Horizon's International Electronics Forum Mojy Chian, vice president of design enablement at GlobalFoundries, was asked how his company could compete with TSMC on cost given its lack of gigafabs. "Advanced technology is not only about cost. At 45-nm we have showed that we can go to high volume production very quickly at high yield," said Chian referring specifically to advanced manufacturing at 45-nm and below.

But when pressed by conference organizer Malcolm Penn, who asked if GlobalFoundries would be outgunned by TSMC by 4 to 1, just as Advanced Micro Devices Inc. (Sunnyvale, Calif.) has been outgunned by Intel Corp., Chian said GlobalFoundries was not so far behind TSMC and that soon to be announced capacity expansions would close the gap. "Does that include TSMC's third 100K wafer fab?" Penn asked "The numbers will be comparable," said Chian.